Researchers at Purdue University and the University of Virginia are now able to create “tiny, thin-film electronic circuits peelable from a surface,” the first step in creating an unobtrusive Internet-of-Things solution. The peelable stickers can sit flush to an object’s surface and be used as sensors or wireless communications systems. The biggest difference between these stickers and traditional solutions is the removal of the silicon wafer that manufacturers use. Because the entire circuit is transferred right on the sticker there is no need for bulky packages and you can pull off and restick the circuits as needed. “We could customize a sensor, stick it onto a drone, and send the drone to dangerous areas to detect gas leaks, for example,” said Chi Hwan Lee, Purdue assistant professor. From the release: A ductile metal layer, such as nickel, inserted between the electronic film and the silicon wafer, makes the peeling possible in water. These thin-film electronics can then be trimmed and pasted onto any surface, granting that object electronic features. Putting one of the stickers on a flower pot, for example, made that flower pot capable of sensing temperature changes that could affect the plant’s growth. The system “prints” circuits by etching the circuit on a wafer and then placing the film over the traces. Then, with the help of a little water, the researchers can peel up the film and use it as a sticker. They published their findings in the Proceedings of the National Academy of Sciences.